超精密ナノ切削

  • M. Heidari, J. Yan: Material removal mechanism and surface integrity in ultraprecision cutting of porous titanium, Precision Engineering, 52 (2018), 356–369

  • R. Komiya, T. Kimura, T. Nomura, M. Kubo, J. Yan: Ultraprecision cutting of single-crystal calcium fluoride for fabricating micro flow cells, Journal of Advanced Mechanical Design,Systems,and Manufacturing, 12, 1 (2018).

  • 鈴木孝彰, 大槻俊紀, 閻 紀旺: 極細線固定砥粒ダイヤモンドワイヤによる単結晶SiC の精密切断, 日本機械学会論文集, 84, 857 (2018).

  • M. Heidari, J. Yan: Nanometer-scale chip formation and surface integrity of pure titanium in diamond turning, International Journal of Advanced Manufacturing Technology, 95 (2018), 479-492.

  • M. Mukaida, J. Yan: Fabrication of Hexagonal Microlens Arrays on Single-Crystal Silicon Using the Tool-Servo Driven Segment Turning Method, Micromachines, 8 (2017), 323.

  • T. Suzuki, Y. Nishino, J. Yan: Mechanisms of material removal and subsurface damage in fixed-abrasive diamond wire slicing of single-crystalline silicon, Precision Engineering, 50(2017), 32-43.

  • P. J. Liew, A. Shaaroni, N. A. C. Sidik, J. Yan: An overview of current status of cutting fluids and cooling techniques of turning hard steel, International Journal of Heat and Mass Transfer, 114 (2017) 380-394.

  • M. Heidari and J. Yan: Ultraprecision surface flattening of porous silicon by diamond turning, Precision Engineering, 49 (2017) 262-277.

  • M. Heidari and J. Yan: Fundamental characteristics of material removal and surface formation in diamond turning of porous carbon, International Journal of Additive and Subtractive Materials Manufacturing, 1 (2017) 23-41.

  • M. Mukaida and J. Yan: Ductile machining of single-crystal silicon for microlens arrays by ultraprecision diamond turning using a slow tool servo, International Journal of Machine Tools & Manufacture, 115 (2017) 2-14.

  • C. Liu, J. Yan, and S. Lin: Diamond turning of high-precision roll-to-roll imprinting molds for fabricating subwavelength gratings, Optical Engineering, 55(6) (2016) 064105.

  • K. Asakura, J. Yan: Water Repellency Control of Oxygen-Free Copper Surface by Diamond-Cut Micro Grooves, International Journal of Automation Technology, 9 (2015) 396-402.

  • 楠 雄策,閻 紀旺:単結晶シリコンの超精密切削における元素ドーピングの影響,砥粒加工学会誌,58, 11 (2014) 699-704.

  • Z. Zhang, H. Peng, J. Yan: Micro-cutting characteristics of EDM fabricated high-precision polycrystalline diamond tools, International Journal of Machine Tools and Manufacture, 65, (2013) 99-106.

  • J. Yan, Y. Nakagawa, K. Watanabe: Fabrication of Thin-Film Fresnel Optics by Combining Diamond Turning and Photolithographic Processes, International Journal of Automation Technology, 7, 4 (2013) 385-390.

  • J. Yan, T. Asami, H. Harada, T. Kuriyagawa: Crystallographic effect on subsurface damage formation in silicon microcutting, CIRP Annals – Manufacturing Technology, 61, 1 (2012) 131-134.

  • Z. Zhang, J. Yan, and T. Kuriyagawa: Study on tool wear characteristics in diamond turning of reaction-bonded silicon carbide, International Journal of Advanced Manufacturing Technology, 57, 1 (2011) 117-125.

  • J. Yan: Ultraprecision cutting of photoresist/gold composite microstructures, CIRP Annals – Manufacturing Technology, 60, 1 (2011) 133-136.

  • J. Yan, Z. Zhang, and T. Kuriyagawa: Effect of Nanoparticle Lubrication in Diamond Turning of Reaction-Bonded SiC, International Journal of Automation Technology, 5, 3 (2011) 307-312.

  • J. Yan, Z. Zhang, and T. Kuriyagawa: Fabricating micro-structured surface by using single-crystalline diamond endmill, International Journal of Advanced Manufacturing Technology, 51, 9 (2010) 957-964.

  • J. Yan, Z. Zhang, and T. Kuriyagawa: Tool wear control in diamond turning of high-strength mold materials by means of tool swinging, CIRP Annals – Manufacturing Technology, 59, 1 (2010) 109-112.

  • J. Yan, T. Oowada, T. Zhou, and T. Kuriyagawa: Precision machining of microstructures on electroless-plated NiP surface for molding glass components, Journal of Materials Processing Technology, 209, 10 (2009) 4802-4808.

  • J. Yan, T. Asami, H. Harada, and T. Kuriyagawa: Fundamental investigation on subsurface damage in single crystalline silicon caused by diamond machining, Precision Engineering, 33, 4 (2009) 378-386.

  • J. Yan, H. Zhao, and T. Kuriyagawa: Effects of tool edge radius on ductile machining of silicon: an investigation by FEM, Semiconductor Science and Technology, 24, 7 (2009) 075018, pp.1-11.

  • J. Yan, Z. Zhang, and T. Kuriyagawa: Mechanism for material removal in diamond turning of reaction-bonded silicon carbide, International Journal of Machine Tools & Manufacture, 49, 5 (2009) 366-374.

  • J. Yan, X. Gai, and T. Kuriyagawa: Fabricating Nano Ribbons and Nano Fibers of Semiconductor Materials by Diamond Turning, Journal of Nanoscience and Nanotechnology, 9, 2 (2009) 1423-1427.

  • J. Yan, T. Asami and T. Kuriyagawa: Nondestructive measurement of the machining-induced amorphous layers in single-crystal silicon by laser micro-Raman spectroscopy, Precision Engineering, 32, 3 (2008) 186-195.

  • J. Yan, H. Baba, Y. Kunieda, N. Yoshihara, and T. Kuriyagawa: Nano precision on-machine profiling of curved diamond cutting tools using a white-light interferometer, International Journal of Surface Science and Engineering, 1, 4 (2007) 441-455.

  • T. Ohta, J. Yan, S. Yajima, Y. Takahashi, N. Horikawa, and T. Kuriyagawa: High-efficiency machining of single-crystal germanium using large-radius diamond tools, International Journal of Surface Science and Engineering, 1, 4 (2007) 374-392.

  • T. Ohta, J. Yan, T. Kuriyagawa, S. Kodera, and T. Nakasuji: Prediction of subsurface damage depth of ground brittle materials by surface profiling, International Journal of Machining and Machinability of Materials, 2, 1 (2007) 108-124.

  • J. Yan, Y. Takahashi, J. Tamaki, A. Kubo, T. Kuriyagawa and Y. Sato: Ultraprecision Machining Characteristics of Poly-crystalline Germanium, JSME International Journal, Series C, 49, 1 (2006) 63-69.

  • J. Yan, K. Maekawa, J. Tamaki and T. Kuriyagawa: Micro grooving on single-crystal germanium for infrared Fresnel lenses, Journal of Micromechanics and Microengineering, 15, 10 (2005) 1925-1931.

  • J. Yan, J. Tamaki, K. Syoji, and T. Kuriyagawa: Single-Point Diamond Turning of CaF2 for Nanometric Surface, International Journal of Advanced Manufacturing Technology, 24, 9-10 (2004) 640-646.

  • J. Yan: Laser micro-Raman spectroscopy of single-point diamond machined silicon substrates, Journal of Applied Physics, 95, 4 (2004) 2094-2101.

  • J. Yan, K. Maekawa, J. Tamaki and A. Kubo: Experimental Study on the Ultraprecision Ductile Machinability of Single-Crystal Germanium, JSME International Journal, Series C, 47, 1 (2004) 29-36.

  • J. Yan, K. Syoji and J. Tamaki: Crystallographic effects in micro/nanomachining of single-crystal calcium fluoride, Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 22, 1 (2004) 46-51.

  • J. Yan, K. Syoji and J. Tamaki: Some observations on the wear of diamond tools in ultra-precision cutting of single-crystal silicon, Wear, 255, 712 (2003) 1380-1387.

  • J. Yan, K. Syoji, T. Kuriyagawa and H. Suzuki: Ductile Regime Turning at Large Tool Feed, Journal of Materials Processing Technology, 121, 2-3 (2002), 363-372.

  • J. Yan, M. Yoshino, T. Kuriagawa, T. Shirakashi, K. Syoji and R. Komanduri: On the Ductile Machining of Silicon for Micro Electro-mechanical Systems (MEMS), Opto-electronic and Optical Applications, Materials Science and Engineering A, 297, 1-2 (2001) 230-234.

超精密マイクロ成形

  • J. Yan, Y. Imoto: Nanoscale surface patterning of diamond utilizing carbon diffusion reaction with a microstructured titanium mold, CIRP Annals – Manufacturing Technology, 67 (2018), 181–184.

  • 井本祐司, 閻 紀旺:純鉄金型を用いたプレス転写による単結晶ダイヤモンドへの微細形状創成,精密工学会誌,83, 8 (2017) 770-774.

  • A. R. Abdul Manaf, T. Sugiyama, J. Yan: Design and fabrication of Si-HDPE hybrid Fresnel lenses for infrared imaging systems, Optics Express, 25 (2017) 1202.

  • Y. Imoto, J. Yan: Thermochemical micro imprinting of single-crystal diamond surface using a nickel mold under high-pressure conditions, Applied Surface Science, 404 (2017) 318-325.

  • A. R. Abdul Manaf, J. Yan: Improvement of form accuracy and surface integrity of Si-HDPE hybrid micro-lens arrays in press molding, Precision Engineering, 47 (2017) 469-479.

  • A. R. Abdul Manaf, J. Yan: Press Molding of a Si-HDPE Hybrid Lens Substrate and Evaluation of Its Infrared Optical Properties, Precision Engineering, 43 (2016) 429-438.

  • 城所貴博,閻 紀旺:高精度プレス焼結によるシリコン・炭素複合厚膜の創製,砥粒加工学会誌,59, 1 (2015) 23-26.

  • T. Zhou, J. Yan, Z. Liang, X. Wang, R. Kobayashi, T. Kuriyagawa: Development of polycrystalline Ni–P mold by heat treatment for glass microgroove forming, Precision Engineering, 39/ 1 (2015) 25-30.

  • J. Yan, A. Horikoshi, T. Kuriyagawa, and Y. Fukushima: Manufacturing Structured Surface by Combining Microindentation and Ultraprecision Cutting, CIRP Journal of Manufacturing Science and Technology, 5, 1 (2012) 41-47.

  • T. Zhou, J. Yan, J. Masuda, T. Oowada, and T. Kuriyagawa: Investigation on Shape Transferability in Ultraprecision Glass Molding Press for Microgrooves, Precision Engineering, 35, 2 (2011) 214-220.

  • J. Masuda, J. Yan, T. Zhou, T. Kuriyagawa, and Y. Fukase: Thermally-induced atomic diffusion at the interface between release agent coating and mould substrate in a glass moulding press, Journal of Physics D: Applied Physics, 44 (2011) 215302, pp.1-12.

  • T. Zhou, J. Yan, N. Yoshihara, T. Kuriyagawa: Study on Nonisothermal Glass Molding Press for Aspherical Lens, Journal of Advanced Mechanical Design, Systems, and Manufacturing, 4, 5 (2010) 804-815.

  • J. Yan, T. Oowada, T. Zhou, and T. Kuriyagawa: Precision machining of microstructures on electroless-plated NiP surface for molding glass components, Journal of Materials Processing Technology, 209, 10 (2009) 4802-4808.

  • T. Zhou, J. Yan, J. Masuda, and T. Kuriyagawa: Investigation on the viscoelasticity of optical glass in ultraprecision lens molding process, Journal of Materials Processing Technology, 209, 9 (2009) 4484-4489.

  • J. Masuda, J. Yan, T. Tashiro, Y. Fukase, T. Zhou and T. Kuriyagawa: Microstructural and Topographical Changes of Ni-P Plated Molds in Glass Lens Pressing, International Journal of Surface Science and Engineering, 3, 1-2 (2009) 86-102.

  • J. Yan, T. Zhou, N. Yoshihara, and T. Kuriyagawa: Shape transferability and microscopic deformation of molding dies in aspherical glass lens molding press, Journal of Manufacturing Technology Research, 1, 1-2 (2009) 85-102.

  • J. Yan, T. Zhou, J. Masuda, and T. Kuriyagawa: Modeling high-temperature glass molding process by coupling heat transfer and viscous deformation analysis, Precision Engineering, 33, 2 (2009) 150-159.

レーザプロセッシング

  • T. Kobayashi, H. Sera, T. Wakabayashi, H. Endo, Y. Takushima, J. Yan: Surface Flattening and Nanostructuring of Steel by Picosecond Pulsed Laser Irradiation, Nanomanufacturing and Metrology, (2018).

  • H. Huang, M. Jiang, J. Yan: The coupling effects of laser thermal shock and surface nitridation on mechanical properties of Zr-based metallic glass, Journal of Alloys and Compounds, 770 (2019), 864-874.

  • N. Takayama, J. Ishizuka, J. Yan: Microgrooving of a single-crystal diamond tool using a picosecond pulsed laser and some cutting tests, Precision Engineering, 53 (2018), 252–262.

  • N. Takayama, S. Asaka, J. Yan: Nanosecond pulsed laser irradiation of sapphire for developing microstructures with deep V-shaped grooves, Precision Engineering, 52 (2018), 440–450.

  • K. Niitsu, Y. Tayama, T. Kato, H. Maehara, J. Yan: Characterization of recrystallized depth and dopant distribution in laser recovery of grinding damage in single-crystal silicon, Materials Science in Semiconductor Processing, 82 (2018), 54–61.

  • N. Takayama, J. Yan: Laser Irradiation Responses of a Single-Crystal Diamond Produced by Different Crystal Growth Methods, Applied Sciences, 7(8), 815 (2017).

  • J. Yan, J. Noguchi, Y. Terashi,: Fabrication of single-crystal silicon micro pillars on copper foils by nanosecond pulsed laser irradiation, CIRP Annals – Manufacturing Technology, 66 (2017) 253-256.

  • H. Huang and J. Yan: Surface patterning of Zr-based metallic glass by laser irradiation induced selective thermoplastic extrusion in nitrogen gas, Journal of Micromechanics and Microengineering , 27 (2017) 075007.

  • N. Takayama, J. Yan: Mechanisms of micro-groove formation on single-crystal diamond by a nanosecond pulsed laser, Journal of Materials Processing Technology, 243 (2017) 299-311.

  • H. Huang, J. Noguchi, J. Yan: Shield gas induced cracks during nanosecond-pulsed laser irradiation of Zr-based metallic glass, Applied Physics A, 122, 10 (2016) 881.

  • H. Huang, J. Noguchi, M. Jiang, R. Moriya, J. Yan: Nanosecond pulsed laser irradiation induced hierarchical micro/nanostructures on Zr-based metallic glass substrate, Materials & Design, 109 (2016) 153-161.

  • J. Yan, K. Okada: Fabrication of silicon-based porous nanocomposite films by focused infrared light sintering, CIRP Annals-Manufacturing Technology, 65 (2016) 217-220.

  • Y. Iwabuchi, J. Yan: Laser sintering of silicon powder and carbon nanofibers for porous composite thick films, Applied Physics Express, 8 (2015) 026501.

  • J. Yan, F. Kobayashi: Laser recovery of machining damage under curved silicon surface, CIRP Annals – Manufacturing Technology, 62, 1 (2013) 199-202.

  • J. Yan, S. Sakai, H. Isogai, and K. Izunome: Characterization of microparticles and oxide layers generated by laser irradiation of diamond-machined silicon wafers, Semiconductor Science and Technology, 26, 2 (2011) 025006, pp.1-7.

  • J. Yan, S. Muto, and T. Kuriyagawa: Development of a high-frequency pulse laser irradiation system for repairing silicon wafers damaged by abrasive machining processes, International Journal of Abrasive Technology, 3, 3 (2010) 175-189.

  • J. Yan, S. Sakai, H. Isogai, and K. Izunome: Recovery of microstructure and surface topography of grinding-damaged silicon wafers by nanosecond-pulsed laser irradiation, Semiconductor Science and Technology, 24, 10 (2009) 105018, pp.1-6.

  • J. Yan, T. Asami and T. Kuriyagawa: Nondestructive measurement of the machining-induced amorphous layers in single-crystal silicon by laser micro-Raman spectroscopy, Precision Engineering, 32, 3 (2008) 186-195.

  • J. Yan, T. Asami and T. Kuriyagawa: Response of machining-damaged single-crystalline silicon wafers to nanosecond pulsed laser irradiation, Semiconductor Science and Technology, 22, 4 (2007) 392-395.

  • J. Yan: Laser micro-Raman spectroscopy of single-point diamond machined silicon substrates, Journal of Applied Physics, 95, 4 (2004) 2094-2101.

マイクロ放電加工

  • T. Tan, J. Yan: Atomic-scale characterization of subsurface damage and structural changes of single-crystal silicon carbide subjected to electrical discharge machining, Acta Materialia, 123 (2017) 362-372.

  • H. Huang, J. Yan: Microstructural changes of Zr-based metallic glass during micro-electrical discharge machining and grinding by a sintered diamond tool, Journal of Alloys and Compounds, 688 (2016) 14-21.

  • H. Huang, J. Yan: On the surface characteristics of a Zr-based bulk metallic glass processed by microelectrical discharge machining, Applied Surface Science, 355 (2015) 1306-1315.

  • J. Yan, T. H. Tan: Sintered diamond as a hybrid EDM and grinding tool for the micromachining of single-crystal SiC, CIRP Annals – Manufacturing Technology, 64, 1 (2015).

  • J. Yan, K. Watanabe, T. Aoyama: Micro-electrical discharge machining of polycrystalline diamond using rotary cupronickel electrode, CIRP Annals – Manufacturing Technology, 63, 1 (2014) 209-212.

  • P. J. Liew, J. Yan, T. Kuriyagawa: Fabrication of Deep Micro Holes in Reaction-Bonded SiC by Ultrasonic Cavitation Assisted Micro EDM, International Journal of Machine Tools and Manufacture, 76 (2014) 13-20.

  • P. J. Liew, K. Shimada, M. Mizutani, J. Yan, T. Kuriyagawa: Fabrication of Microstructures on RB-SiC by Ultrasonic Cavitation Assisted Micro-Electrical Discharge Machining, International Journal of Automation Technology, 7, 6 (2013) 621-629.

  • P. J. Liew, J. Yan, T. Kuriyagawa: Experimental Investigation on Material Migration Phenomena in Micro EDM of Reaction-Bonded Silicon Carbide, Applied Surface Science, 276 (2013) 731-743.

  • P. J. Liew, J. Yan, T. Kuriyagawa: Carbon nanofiber assisted micro electro discharge machining of reaction-bonded silicon carbide, Journal of Materials Processing Technology, 213, 7 (2013) 1076-1087.

  • Z. Zhang, H. Peng, J. Yan: Micro-cutting characteristics of EDM fabricated high-precision polycrystalline diamond tools, International Journal of Machine Tools and Manufacture, 65, (2013) 99-106.

  • J. Yan, T. Kaneko, K. Uchida, N. Yoshihara, T. Kuriyagawa: Fabricating micro grooves with varied cross-sections by electro discharge machining, International Journal of Advanced Manufacturing Technology, 50, 9-12 (2010) 991-1002.

  • J. Yan, K. Uchida, N. Yoshihara, and T. Kuriyagawa: Fabrication of micro end mills by wire EDM and some micro cutting tests, Journal of Micromechanics and Microengineering, 19, 2 (2009) 025004, pp. 1-9.

  • T. Masaki, T. Kuriyagawa, J. Yan, and N. Yoshihara: Study on shaping spherical Poly Crystalline Diamond tool by Micro-electro-Discharge Machining and micro-grinding with the tool, International Journal of Surface Science and Engineering, 1, 4 (2007) 344-359.

ナノインデンテーション

  • H. Huang, J. Yan: Multi-scale dimple creation on metallic glass by a two-step method involving nanoindentation and polishing, Applied Surface Science, 462 (2018), 565–574.

  • K. Kosai, H. Huang, J. Yan: Comparative Study of Phase Transformation in Single-Crystal Germanium during Single and Cyclic Nanoindentation, Crystals, 7 (2017), 333.

  • H. Huang, J. Yan: Investigating shear band interaction in metallic glasses by adjacent nanoindentation, Materials Science & Engineering A, 704(2017), 375-385.

  • M. Matsumoto, H. Huang, H.Harada, K.Kakimoto and J. Yan: On the phase transformation of single-crystal 4H–SiC during nanoindentation, Journal of Physics D: Applied Physics , 50 (2017) 265303.

  • W. Wang, P. Yao, J. Wang, C. Huang, H. Zhu, B. Zou, H. Liu, J. Yan: Crack-free ductile mode grinding of fused silica under controllable dry grinding conditions, International Journal of Machine Tools and Manufacture, 109 (2016) 126-136.

  • H. Huang, J. Yan: Volumetric and timescale analysis of phase transformation in single-crystal silicon during nanoidentation, Applied Physics A, 122, 607 (2016) 1-11.

  • Q. Wang, F. Zhou, J. Yan: Evaluating mechanical properties and crack resistance of CrN, CrTiN, CrAlN and CrTiAlN coatings by nanoindentation and scratch tests, Surface and Coatings Technology, 285 (2016) 203-213.

  • H. Huang, J. Zhang, C. Shek, J. Yan: Effects of pre-compression deformation on nanoindentation response of Zr65Cu15Al10Ni10 bulk metallic glass, Journal of Alloys and Compounds, 674 (2016) 223-228.

  • H. Huang, J. Yan: In situ characterization of formation and growth of high-pressure phases in single-crystal silicon during nanoindentation, Applied Physics A – Material Science & Processing, 122, 409 (2016) 1-7.

  • H. Huang, J. Yan: Possibility for rapid generation of high-pressure phases in single-crystal silicon by fast nanoindentation, Semiconductor Science and Technology, 30 (2015) 115001.

  • Q. Wang, Z. Wu, F. Zhou, J. Yan: Comparison of crack resistance between ternary CrSiC and quaternary CrSiCN coatings via nanoindentation, Materials Science and Engineering: A, 642 (2015) 391-397.

  • Q. Wang, Z. Wu, F. Zhou, H. Huang, K. Niitsu, J. Yan: Evaluation of crack resistance of CrSiCN coatings as a function of Si concentration via nanoindentation, Surface and Coatings Technology, 272 (2015) 239-245.

  • H. Huang, J. Yan: On the mechanism of secondary pop-out in cyclic nanoindentation of single-crystal silicon, Journal of Materials Research, 30, 11 (2015) 1861-1868.

  • H. Huang and J. Yan: New insights into phase transformations in single crystal silicon by controlled cyclic nanoindentation, Scripta Materialia, 102 (2015) 35-38.

  • S. Goel, N. Faisal, X. Luo, J. Yan, A. Agrawal: Nanoindentation of polysilicon and single crystal silicon: Molecular dynamics simulation and experimental validation, Journal of Physics D: Applied Physics, 47 (2014) 275304.

  • S. Goel, J. Yan, X. Luo, A. Agrawal: Incipient plasticity in 4H-SiC during quasistatic nanoindentation, Journal of the Mechanical Behavior of Biomedical Materials, 34 (2014) 330-337.

  • J. Yan, A. Horikoshi, T. Kuriyagawa, and Y. Fukushima: Manufacturing Structured Surface by Combining Microindentation and Ultraprecision Cutting, CIRP Journal of Manufacturing Science and Technology, 5, 1 (2012) 41-47.

  • J. Yan, X. Gai and H. Harada: Subsurface damage of single crystalline silicon carbide in nanoindentation tests, Journal of Nanoscience and Nanotechnology, 10, 11 (2010) 7808-7811.

  • T. Kiriyama, H. Harada, and J. Yan: Finite element modeling of high-pressure deformation and phase transformation of silicon beneath a sharp indenter, Semiconductor Science and Technology, 24, 2 (2009) 025014, pp. 1-12.

  • J. Yan, J. Tamaki, H. Zhao and T. Kuriyagawa: Surface and subsurface damages in nanoindentation tests of compound semiconductor InP, Journal of Micromechanics and Microengineering, 18, 10 (2008) 105018, pp.1-10.

  • J. Yan, H. Takahashi, X. Gai, H. Harada, J. Tamaki and T. Kuriyagawa: Load effects on the phase transformation of single-crystal silicon during nanoindentation tests, Materials Science and Engineering A, 423, 1-2 (2006) 19-23.

  • J. Yan, H. Takahashi, J. Tamaki, X. Gai, and T. Kuriyagawa: Transmission electron microscopic observation of nanoindentations made on ductile-machined silicon wafers, Applied Physics Letters, 87, 11 (2005) 211901, pp.1-3.

  • J. Yan, H. Takahashi, J. Tamaki, X. Gai, H. Harada, and J. Patten: Nanoindentation tests on diamond-machined silicon wafers, Applied Physics Letters, 86, 5 (2005) 181913, pp. 1-3.

ナノマテリアル創製

  • J. Yan, K. Okada: Fabrication of silicon-based porous nanocomposite films by focused infrared light sintering, CIRP Annals-Manufacturing Technology, 65 (2016) 217-220.

  • Y. Iwabuchi, J. Yan: Laser sintering of silicon powder and carbon nanofibers for porous composite thick films, Applied Physics Express, 8 (2015) 026501.

  • 城所貴博,閻 紀旺:高精度プレス焼結によるシリコン・炭素複合厚膜の創製,砥粒加工学会誌,59, 1 (2015) 23-26.

  • P. J. Liew, J. Yan, T. Kuriyagawa: Experimental Investigation on Material Migration Phenomena in Micro EDM of Reaction-Bonded Silicon Carbide, Applied Surface Science, 276 (2013) 731-743.

  • P. J. Liew, J. Yan, T. Kuriyagawa: Carbon nanofiber assisted micro electro discharge machining of reaction-bonded silicon carbide, Journal of Materials Processing Technology, 213, 7 (2013) 1076-1087.

  • J. Yan, Z. Zhang, and T. Kuriyagawa: Effect of Nanoparticle Lubrication in Diamond Turning of Reaction-Bonded SiC, International Journal of Automation Technology, 5, 3 (2011) 307-312.

  • J. Yan, S. Sakai, H. Isogai, and K. Izunome: Characterization of microparticles and oxide layers generated by laser irradiation of diamond-machined silicon wafers, Semiconductor Science and Technology, 26, 2 (2011) 025006, pp.1-7.

表面・界面特性

  • Q. Wang, F. Zhou, Q. Ma, M. Callisti, T. Polcar, J. Yan: Fracture toughness and sliding properties of magnetron sputtered CrBC and CrBCN coatings, Applied Surface Science, 443 (2018), 635–643.

  • Y. Imoto, J. Yan: Thermochemical micro imprinting of single-crystal diamond surface using a nickel mold under high-pressure conditions, Applied Surface Science, 404 (2017) 318-325.

  • J. Wang, L.Wan, J. Chen, J. Yan: Micropatterning of diamond crystallites via cobalt-catalyzed thermochemical etching, Journal of Material Science, 52 (2017) 709-720.

  • J. Wang, L. Wan, J. Chen, J. Yan: Surface patterning of synthetic diamond crystallites using nickel powder, Diamond & Related Materials, 66 (2016) 206-212

  • K. Asakura, J. Yan: Water Repellency Control of Oxygen-Free Copper Surface by Diamond-Cut Micro Grooves, International Journal of Automation Technology, 9 (2015) 396-402.

  • J. Wang, L. Wan, J. Chen, J. Yan: Anisotoropy of synthetic diamond in catalytic etching using iron powder, Applied Surface Science, 346 (2015) 388-393

  • Q. Wang, F. Zhou, S. Gao, Z. Zhou, L. Li, J. Yan: Effect of counterparts on the tribological properties of TiCN coatings with low carbon concentration in water lubrication, Wear, 328-329 (2015) 356-362

  • Q. Wang, F. Zhou, S. Gao, Z. Zhou, L. Li, J. Yan: Influence of carbon concentration on the electrochemical behavior of CrCN coatings in simulated body fluid, Surface & Coatings Technology, 265 (2015) 16-23

  • Q. Wang, F. Zhou, C. Wang, M. Yuen, M. Wang, T. Qian, M. Matsumoto, J. Yan: Comparison of tribological and electrochemical properties of TiN CrN TiAlN and a-C H coatings in simulated body fluid, Materials Chemistry and Physics, 158 (2015) 74-81

  • Q. Wang, F. Zhou, Z. Zhou, L. Li, J. Yan: Electrochemical performance of TiCN coatings with low carbon concentration in simulated body fluid, Surface & Coatings Technology, 253 (2014) 199-204

  • J. Masuda, J. Yan, T. Zhou, T. Kuriyagawa, and Y. Fukase: Thermally-induced atomic diffusion at the interface between release agent coating and mould substrate in a glass moulding press, Journal of Physics D: Applied Physics, 44 (2011) 215302, pp.1-12.

  • J. Masuda, J. Yan, T. Tashiro, Y. Fukase, T. Zhou and T. Kuriyagawa: Microstructural and Topographical Changes of Ni-P Plated Molds in Glass Lens Pressing, International Journal of Surface Science and Engineering, 3, 1-2 (2009) 86-102.

  • J. Yan, T. Asami and T. Kuriyagawa: Nondestructive measurement of the machining-induced amorphous layers in single-crystal silicon by laser micro-Raman spectroscopy, Precision Engineering, 32, 3 (2008) 186-195.

  • T. Ohta, J. Yan, T. Kuriyagawa, S. Kodera, and T. Nakasuji: Prediction of subsurface damage depth of ground brittle materials by surface profiling, International Journal of Machining and Machinability of Materials, 2, 1 (2007) 108-124.

  • J. Yan: Laser micro-Raman spectroscopy of single-point diamond machined silicon substrates, Journal of Applied Physics, 95, 4 (2004) 2094-2101.